Siemens Digital Industries Software Blog Network

Siemens Digital Industries Software Blogs


Siemens Software Podcast Network

The Resurgence of Nuclear Energy - Part 2

In part 2 of our Nuclear Series, our panel discusses the critical role of supply chain management, data orchestration, and...

Thought Leadership

Capturing manufacturing data and processes with AI podcast - Transcript

Artificial intelligence is having a major impact on the way products are designed and manufactured. Applying AI to the manufacturing...

Polarion

Enhancing Efficiency in Polarion with AI-Driven Requirements Management

Requirements management is one of the most complex and error-prone aspects of project development. Without the right toolchain, teams struggle...

Design with Calibre

Siemens shines at the 2025 SPIE Advanced Lithography + Patterning symposium

The SPIE Advanced Lithography + Pattering symposiums were held 23-27 February this year with the usual enthusiastic and sizable attendance...

Electronic Systems Design

Blind and buried vias: An HDI technology

One of the key innovations within HDI PCB design is the use of blind and buried vias, which enhance routing capabilities by freeing up additional routing resources, increasing the amount of routing channels while requiring fewer signal layers, and optimizing board space.

Simcenter

How to use digital tools to meet EEXI targets across your fleet

In June 2021, the International Maritime Organization (IMO) adopted amendments to MARPOL Annex VI that introduced an Energy Efficiency Index...

Siemens Software Podcast Network

Advanced robotics and AI in industrial manufacturing- Episode 1

In the first episode of the advanced robotics series in our Digital Transformation podcast, host Chris Pennington, global industry marketing...


The Art of the Possible

From Outdated to Up to Date: Modernizing Deprecated Code with Multi-Agents

Automation in Simcenter STAR-CCM+ with Java Macro Automation in Simcenter STAR-CCM+ has revolutionized how users interact with CFD simulations, providing...

EDA Support Blogs

3D-IC design using Calibre 3DSTACK

By Minjung Han (minjung.han@siemens.com), Calibre Support Application Engineer 3D-IC technology is gaining attention as an alternative to complement Moore’s Law,...