MENTOR GRAPHICS AT ARM TECHCON
This week ARM® TechCon® 2013 is being held at the Santa Clara Convention Center from Tuesday October 29 through Thursday October 31st, but don’t worry, there’s nothing to be scared about. The theme is “Where Intelligence Counts”, and in fact as a platinum sponsor of the event, Mentor Graphics is excited to present no less than ten technical and training sessions about using intelligent technology to design and verify ARM-based designs.
My personal favorite is scheduled for Halloween Day at 1:30pm, where I’ll tell you about a trick that Altera used to shave several months off their schedule, while verifying the functionality and performance of an ARM AXI™ fabric interconnect subsystem. And the real treat is that they achieved first silicon success as well. In keeping with the event’s theme, they used something called “intelligent” testbench automation.
And whether you’re designing multi-core designs with AXI fabrics, wireless designs with AMBA® 4 ACE™ extensions, or even enterprise computing systems with ARM’s latest AMBA® 5 CHI™ architecture, these sessions show you how to take advantage of the very latest simulation and formal technology to verify SoC connectivity, ensure correct interconnect functional operation, and even analyze on-chip network performance.
On Tuesday at 10:30am, Gordon Allan described how an intelligent performance analysis solution can leverage the power of an SQL database to analyze and verify interconnect performance in ways that traditional verification techniques cannot. He showed a wide range of dynamic visual representations produced by SoC regressions that can be quickly and easily manipulated by engineers to verify performance to avoid expensive overdesign.
Right after Gordon’s session, Ping Yeung discussed using intelligent formal verification to automate SoC connectivity, overcoming observability and controllability challenges faced by simulation-only solutions. Formal verification can examine all possible scenarios exhaustively, verifying on-chip bus connectivity, pin multiplexing of constrained interfaces, connectivity of clock and reset signals, as well as power control and scan test signal connectivity.
On Wednesday, Mark Peryer shows how to verify AMBA interconnect performance using intelligent database analysis and intelligent testbench automation for traffic scenario generation. These techniques enable automatic testbench instrumentation for configurable ARM-based interconnect subsystems, as well as highly-efficient dense, medium, sparse, and varied bus traffic generation that covers even the most difficult to achieve corner-case conditions.
And finally also on Halloween, Andy Meyer offers an intelligent workshop for those that are designing high performance systems with hierarchical and distributed caches, using either ARM’s AMBA 5 CHI architecture or ARM’s AMBA 4 ACE architecture. He’ll cover topics including how caching works, how to improve caching performance, and how to verify cache coherency.
For more information about these sessions, be sure to visit the ARM TechCon program website. Or if you miss any of them, and would like to learn about how this intelligent technology can help you verify your ARM designs, don’t be afraid to email me at firstname.lastname@example.org. Happy Halloween!