End of the Lent – the Holy Week is approaching…

Well, the Christian world needs to wait a couple of more weeks for Easter to come. But the lent of the semiconductor thermal management community is close to finish – at least after a long period of my silence here – since I am writing a new post again. And the reason is that we are facing a very busy week: for the semiconductor thermal management community the week between 20 and 26 March will be like the Holy Week…

For us this will be the week of SEMI-THERM – the 27th annual IEEE Semiconductor Thermal Management Symposium. The organizers, SEMI-THERM and MEPTEC call it the 2011 Electronics Thermal Week.

There will be great many activities – and many of them will be related to some extent to the most recent JEDEC thermal measurement standard JESD51-14 titled “TRANSIENT DUAL INTERFACE TEST METHOD FOR THE MEASUREMENT OF THE THERMAL RESISTANCE JUNCTION-TO-CASE OF SEMICONDUCTOR DEVICES WITH HEAT FLOW TROUGH A SINGLE PATH”. First of all, SEMI-THERM starts with a short course by Dirk Schweitzer and Heinz Pape from Infineon which will deal with the details of this method – the principle of which was briefly described in my prior blog post “A transient in methods: the RthJC transient method“. The short course is titled Transient Rth-JC Measurement and Compact Thermal Model Generation and will take place on the 20th of March in the Doubletree Hotel in San Jose, CA. (Find more details about this in the Advance Program of SEMI-THERM.)

The principle of the transient RthJC measurement - as shown in the JESD51-14 standard

The principle of the transient RthJC measurement - as shown in the JESD51-14 standard.

On the 21st of March events continue with The Heat is On seminar organized by MEPTEC. I have the honor to contribute to the technical program of this seminar with a talk on thermal standardization activities of power LEDs. I will present an update of the paper I presented last time at the 2010 SPIE Solid-State Lighting Conference in August 2010 in San Diego. This time further thermal transient measurement results performed during LM80 tests of LEDs will be shown (after 6000+ hours of testing time have elapsed) and problems related to thermal impedance of AC driven LED light sources will also be raised.  Technical details regarding the measurement of the AC thermal impedance of LEDs will be discussed in our common technical paper with Bernie Siegal from Thermal Engineering Associates – to be presented in the LED session of the SEMI-THERM conference (session 14, 24th of March, 11:10 am).

Structural degradation of an LED and TIM ageing as shown by structure functions taken during LM80 tests performed at the University of Pannonia (Veszprém, Hungary).

Structural degradation of an LED and TIM ageing as shown by structure functions taken during LM80 tests performed at the University of Pannonia (Veszprém, Hungary).

CFD simulation results for a retrofit AC LED lamp being tested in an integrating sphere having a plastic wall.

CFD simulation results for a retrofit AC LED lamp being tested in an integrating sphere having a plastic wall.

LED and TIM testing news along with advance information about our implementation of the JESD51-14 RthJC measurement standard will be discussed at Mentor Graphics workshops during the SEMI-THERM exhibition which will take place in the afternoon, on the 22nd and on the 23rd of March. During the workshop on the 23rd of March not only testing and product news will be provided but I shall also show how TIM testing and JESD51-14 compliant transient RthJC measurements are related and how such RthJC measurements can support test based compact modelingof power semiconductor packages, including power LEDs. The good news is that this test based compact modeling option bridges the gap between thermal testing and simulation. In Mentor Graphics terms: builds a bridge between our flagship products FloTHERM and T3Ster. This bridge realized by the T3Ster-Master program. So far so good. If you are interested in more details, please come and visit our workshops. Yes, not only the workshop related to thermal testing, but also the FloTHERM workshop that will be given by my acknowledged colleage from the CFD world – Robin.

The new T3Ster-Master program is a powerful tool to support test based compact modeling. It uses the new JESD51-14 RthJC measurement standard to find the case node of a package model to be propagated towards FloTHERM.

The new T3Ster-Master program is a powerful tool to support test based compact modeling. It uses the new JESD51-14 RthJC measurement standard to help finding the case node of a package model to be propagated towards FloTHERM.

The highlight of the week is always the Awards Luncheon of SEMI-THERM, where the annual THERMI Award and the Harvey Rosten Award are presented. This year everything is around the new transient measurement standard. Well, not quite like this but still. This year’s reciepent of the Harvey Rosten Award for excellence is Dirk Schweitzer  for his paper “The Junction-To-Case Thermal Resistance: a Boundary-Condition-Dependent Thermal Metric, presented at SEMI-THERM 2010. And then excitement comes: who wins this year’s best paper award of SEMI-THERM… It’s like the Oscar’s Gala in LA. That’s what we’ll learn on the spot…

On the 25th of March the 2011 Electronics Thermal week concludes with the regular meeting of the JEDEC JC15 committee on thermal standardization of packaged semiconductor devices. Among many things the LED testing proposals will be discussed…

So, we are facing a really busy and exciting week. Last, but not least: besides the seminars, workshops and technical papers you can also learn about Mentor Graphics’ thermal testing and simulation technologies if you visit us at our booth during the exhibit hours at SEMI-THERM. Come, and see us in the Doubletree Hotel in San Jose next week!

See you there: András

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Thermal testing: measuring the real world

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