John Parry’s Blog
John Parry’s Blog RSSRoundup of SEMI-THERM, FloTHERM IC launch and JEDEC
I’m just back from a very productive SEMI-THERM Conference where we launched our new FloTHERM IC product. We had meetings with the editors of 5 leading electronics magazines to coincide with the launch, which was made at our vendor presentation during the exhibition at the start of Tuesday afternoon. Well done to all involved! If you want to see what others are saying about FloTHERM IC check out the write ups in Embedded Computing, Business Wire and EE Times to name just a few. It offers massive productivity enhancement for anyone generating package thermal metrics by simulation as it completely automates the process.
I unfortunately missed the FloTHERM IC presentation as I was showing the publisher of ElectronicsCooling Magazine around the exhibition ahead of the re-launch of the print publication next month. If you’ve not seen it already, check out the cool new web site.
It was interesting to see a complete off-the-shelf primed and sealed liquid cooling solution for a high end graphics card, capable of cooling well over 400W. The technology is largely in place for this approach to become the standard cooling solution for high-end graphics cards and processors, perhaps allowing a step change in performance provided applications are available to drive demand and make the increased cost worthwhile. Over time the cost increment of liquid cooling solutions will diminish as heat sink size and fan performance demands push up the cost of air cooling.
At the Awards Luncheon on Thursday I presented the “Harvey Rosten Award for Excellence” to Prof. Suresh V. Garimella and Tannaz Harirchian for their paper “Boiling Heat Transfer and Flow Regimes in Microchannels – a Comprehensive Understanding” that was presented at the THERMINIC Workshop last October in Leuven, Belgium. Here’s a link to the abstract.
Next year the SEMI-THERM conference will be in the Doubletree Hotel in San Jose, CA on March 20-24. Well worth marking your calendars, and if you’re in the area don’t forget entrance to the exhibition is FREE!
I attended the JEDEC JC15 Committee meeting after the conference to report on the progress that’s been made on an XML-based file format for the exchange of thermal resistance network based compact thermal models (CTMs) of electronic components and to re-start a similar activity relating to power maps. Fingers crossed, I’m hoping to make good progress on these in the next few months.
Tags: 2-Resistor model, DELPHI model, electronics cooling, FloTHERM, FloTHERM IC, JEDEC, JEDEC JC15, SEMI-THERM conference, thermal design, thermal management
NEW ElectronicsCooling Magazine Website
Just a very quick post to alert you to the new ElectronicsCooling Magazine web site. We’ve updated the look of the site to improve navigation ahead of the relaunch of the printed magazine. Here’s just some of the features of the new site:
- New look and feel
- Search
- Improved Article and Content Navigation by author; category (Calculation Corner, New Products, Technical Brief); channel (Industries, Applications) and by tag
- Improved Home page layout, quick access to subscribe, featured content, new products
- Improved Article presentation and layout with Tags, Share This, Print This and Links to categories, authors, issues
- Related Articles
- HTML Buyer’s Guide and Downloadable Buyer’s guide (PDF)
- Improved access and layout of past issues
- RSS Feed for all content
If you’re not yet a subscriber to ECM then I’d encourage you register and bookmark the page as the site is the foremost technical resource for information on electronics cooling and thermal design. Also check out Mentor’s Electronics Cooling Community
That’s me done for this week. Next week I’m at SEMI-THERM so if you’re in the bay area stop by the FREE Exhibition in the afternoon on Tuesday and Wednesday, 23 & 24 February 2010.
Dr. J, Hampton Court UK
Tags: CFD, design process, electronics cooling, FloEFD, FloTHERM, FloTHERM.PACK, FloTHERM.PCB, SEMI-THERM conference, thermal design, thermal management
Foresight and X-Ray Vision or Hindsight and Regret?
I was on a conference call and WebEx yesterday with the NAFEMS CFD Working Group, of which Mentor Graphics is a member. One of the people on the call had a lot of background noise on his phone, which turned out to be a due to a fan by his desk to keep his computer cool.
Computational Fluid Dynamics (CFD) is a memory hungry, CPU intensive activity so I guess he was running a fairly substantial case. Even so, after 20+ years of electronics cooling CFD it’s a little disappointing that end users have to go to such lengths to keep their hardware cool. Particularly so, given it’s the middle of winter in the northern hemisphere and computers should be designed to withstand a 40+°C ambient temperature – that’s a more than most people can comfortably bear in the office!
Tags: CFD, concurrent CFD, design process, electronics cooling, experiential learning, FloTHERM, Kolb's learning styles, NAFEMS, thermal design, thermal management, upfront analysis, upfront CFD, X-ray vision
FREE Exhibition at SEMI-THERM, Santa Clara February 23-24
I’m off to SEMI-THERM later this month. SEMI-THERM is one of the premier thermal management conferences and has the best exhibition by far.
The conference runs from 21-25 February, the first two days of which are devoted to professional short courses delivered by a number of leading names in electronics cooling, and past recipients of the IEEE’s THERMI Award. Short courses at SEMI-THERM 26 are eligible for CEU credits through the IEEE which are IACET approved. The short courses can be booked independently from the conference using the form at the back of the Advance Program.
One of the many things that set SEMI-THERM apart from other conferences is the quality of its exhibition, which takes place in the afternoon on Tuesday 23rd and Wednesday 24th February.
Tags: electronics cooling, FloTHERM, JEDEC JC15, SEMI-THERM conference, SEMI-THERM exhibition, thermal design, thermal management, Thermal standards
Stop Press: New Electronics Cooling Community
Are you concerned with the thermal design of electronics systems? Are you a thermal, mechanical or electrical engineer wrestling with product design issues? Or are you an engineering manager or director concerned with improving your team’s overall design flow? Then Mentor’s new Electronics Cooling community is for you.
No electronics cooling or thermal design topic is too small or complex, from die-level heat dissipation right up to data center cooling, and everything in between!
Feel free to use the community to network with peers, exchange tips, pose questions, share industry news, offer opinions, and read blogs, etc. Mentor Graphics customers can also share models and macros under the Models sub-community, which is visible to those who’ve logged in with a SupportNet login. Otherwise registration just takes a few seconds.
Dr J, Hampton Court
Tags: CFD, design flow, design process, electronics cooling, FloEFD, FloTHERM, FloTHERM.PACK, FloTHERM.PCB, thermal design, thermal management
About John Parry’s Blog
A mixed bag of things that interest me professionally -CFD technology and its use in education, cooling technologies and the place of thermal design in the overall design flow.
Latest Posts
- Roundup of SEMI-THERM, FloTHERM IC launch and JEDEC
- NEW ElectronicsCooling Magazine Website
- Liquid Cooling – Are We There Yet?
- Foresight and X-Ray Vision or Hindsight and Regret?
- FREE Exhibition at SEMI-THERM, Santa Clara February 23-24
- Force Prediction with Concurrent CFD

