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Thanks for the memory

Posted Feb 8, 2010, by Colin Walls

The computer world is often accused of being mired in jargon and I think that is a fair criticism. In some ways it gets worse when an everyday word is “hijacked” to have a new meaning. A good example is “program”, which had several meanings before it was applied to software. Interestingly, in the UK we use the US spelling ["program"] to refer to software, but retain the English version ["programme"] … Read More

Tags: memory, embedded software

"Sledgehammer CFD" - The Best Approach?

Posted Feb 8, 2010, by David Tatchell

Re-reading my last blog (Beginning at the Beginning …5 Parabolic or Elliptic, Or Somewhere In Between?) a slightly disturbing thought occurred to me. Does the distinction, highlighted in that blog, between parabolic, partially-parabolic, and elliptic solution methods have any real relevance to present day CFD? On consideration, the honest answer is - only to a very limited extent. In the 1970s when … Read More

Tags: CFD Ease of Use, History of CFD, CFD

Take the High Road to Power-Optimized RTL

Posted Feb 5, 2010, by Thomas Bollaert

The latest edition of Chip Design Magazine features an insightful head-to-head discussion between Atrenta’s Kiran Vittal and Mentor’s Shawn McCloud. The topic: how to best achieve power-optimized RTL. Should low-power optimizations be performed in the RTL? Or is there more potential for power savings when starting from a more abstract design representation? The two industry experts share their viewpoints. Atrenta’s … Read More

Tags: Catapult, Chip Design Magazine, Atrenta, high-level synthesis, Low-power

Driving the connected car

Posted Feb 5, 2010, by John Day

I want lots of connectivity in my next car and have every reason to expect it (and, of course, to use it responsibly). We’re talking-cutting edge technology of the kind increasingly available to mid-range buyers; features like Internet access, voice recognition, full-color touch-screen displays, diagnostics, and various forms of infotainment. I was a bit surprised to learn that all of that and more … Read More

Tags: OLED displays, Network Car, LCD, Android, Linux, Bluetooth, Microsoft, Netscape, 3G cellular, Google, Delphi, IBM, DSRC, infotainment, Bob Schumacher, Internet access, COMDEX, DVB-T, DVB-SH, Genivi Consortium, QNX, voice recognitiion, Wi-Fi, touch-screen displays, USB, smartphones, Sun Microsystems

How much do ‘U-Value’ good thermal insulation? Part III

Posted Feb 5, 2010, by Robin Bornoff

As covered in the previous blog, air that sticks to the inside and outside walls offers a resistance to the heat that passes from the room to the inside of the wall and from the outside of the wall to the outside air. These two resistances make up part of the overall U-value, the overall ease by which heat can pass through the entire wall (or window or door etc.). The rest of the U-value is made up … Read More

Tags: FloVENT, HVAC, boundry

How to MV in 10 easy steps (really over simplified backend flow)

Posted Feb 4, 2010, by Arvind Narayanan

Step 0 Commitment – Are you really sure you want to MV? Are you positive that Multi-Vt & Clock gating would not help with your power budgets? Proceed to step1 with caution only if you really must. Step 1 Architecture Selection – Ensure that the architecture is frozen and capture all the power constraints required for the chosen MV style in the UPF file. As most of you are aware this can also be done … Read More

Tags: Isolation cells, Level Shifter, Always on Buffers, Power switches, UPF, MTCMOS, Multi-Voltage

May I have the envelope, please...

Posted Feb 4, 2010, by Mark Forbes

Here are the winners of the Planet HyperLynx leather jackets: Jim Antonellis - Broadcom Corporation John Phillips - Curtis Wright Controls Embedded Computing  Michael Yukelson - SeaMicro  Congratulations to our three winners!  And, while you’re here, take one of the links on this page to learn more about HyperLynx. … Read More

Tags: HyperLynx, Planet HyperLynx, DesignCon 2010

FREE Exhibition at SEMI-THERM, Santa Clara February 23-24

Posted Feb 3, 2010, by John Parry

I’m off to SEMI-THERM later this month. SEMI-THERM is one of the premier thermal management conferences and has the best exhibition by far. The conference runs from 21-25 February, the first two days of which are devoted to professional short courses delivered by a number of leading names in electronics cooling, and past recipients of the IEEE’s THERMI Award. Short courses at SEMI-THERM 26 are eligible … Read More

Tags: Thermal standards, FloTHERM, JEDEC JC15, Electronics Cooling, Thermal Design, thermal management, SEMI-THERM conference, SEMI-THERM exhibition

OVM/VMM Interoperability Kit: It’s Ready!

Posted Feb 3, 2010, by Dennis Brophy

3 – 2 – 1 – DOWNLOAD! As I mentioned in a previous blog, the Accellera OVM/VMM Interoperability kit code that is a companion to the Verification Intellectual Property Recommended Practices (1MB PDF) was nearing readiness.  As of today, it is now ready for download and use.  With qualification tests run on verification platforms from the Big-3 EDA companies, no objection was voiced at a recent Accellera … Read More

Tags: OVM, Standards, accellera, vip-tsc, VMM

A great start to DesignCon

Posted Feb 3, 2010, by Steve McKinney

If you’re here at DesignCon, you already know this, but it’s been a great start to the tremendously high tech week. Yesterday, there were some interesting tutorial sessions which I pointed out in my previous blog. And today, there were some great presentations of papers that were written for the conference (making it the best high speed technical conference of the year in my opinion).  I attended … Read More

Tags: Uncategorized